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Description
- High-performance thermal pad with phase change material for optimum heat transfer
- Excellent thermal conductivity for efficient cooling of CPUs, GPUs and other electronic components
- Solid at room temperature, only liquefies from 45°C for easy application
- Very low viscosity in liquid state for minimal layer thickness
- Reduced pump-out effect due to contraction during solidification
- Non-electrically conductive - safe for sensitive electronics
- Long-lasting performance with stable thermal conductivity after approx. 10 thermal cycles