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Description
- Electrically non-conductive thermal putty ideal for replacing traditional thermal pads in GPU modifications.
- Flexible gap filler that compensates for height differences between components, ensuring optimal thermal contact.
- Easy application using included spatulas or by hand; recommended to wear gloves during manual application.
- Effectively bridges height differences ranging from 0.2 mm to 3.0 mm for versatile use across various components.
- Available in three variants—Basic, Advance, and Pro—offering different levels of thermal conductivity to suit specific needs.
- Basic variant provides moderate thermal conductivity, suitable for standard cooling requirements.
- Advance variant offers improved thermal conductivity for enhanced heat dissipation.